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| T10XB Series (SIP) 10-AMPERE SILICON BRIDGE RECTIFIER FEATURES * * * * Low Reverse Leakage Current Surge Overload Rating to 120A Peak Ideal for Printed Circuit Board Applications Epoxy Material - UL Recognition Flammability Classification 94V-0 Mechanical Data * * * Case: Molded Epoxy Resin Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 Polarity: Molded on Body 2542 Highlander Way ! Carrollton, TX 75006 UNIT: mm Maximum Ratings & Characteristics Single Phase, 60 Hz, Resistive or Inductive Load Ta = 25C Unless Otherwise Specified CHARACTERISTIC Peak Repetitive Reverse Voltage RMS Reverse Voltage Average Rectified Output Current @ TC = 108C w/ cooling fin Average Rectified Output Current @ Ta = 25C w/o cooling fin Non-Repetitive Peak Forward Surge Current 10 mS single half sine-wave superimposed on rated load Maximum Forward Voltage per Element, IF = 5.0 A Peak Reverse Current per element at VR = VRRM Operating and Storage Temperature Range SYMBOL VRRM VR(RMS) Io Io IFSM VF IR TJ ,Tstg T10XB40 400 280 T10XB60 600 420 10.0 2.7 120 1.05 10 -40 to +150 T10XB80 800 560 UNIT V V A A A V A C 972-248-2888 www.collmer.com Reference Table for Heat-Sink Size Average Rectified Output Current in Amps 2 Cooling Fin Single-face Area S1 (cm ) 2 Cooling Fin Single-face Area S2 (cm ) 3.0 4 8 5.0 75 65 7.5 180 100 9 500 310 11 900 490 Note: Vertical Mounting at Ta = 40C. HS Material: S1 = 1.5mm-Thick Aluminum, S2 = 3.0mm-Thick Copper Manufactured by Tianjin Zhong - Huan Semiconductor Co., Ltd. Rev 0, Sep 2002 T10XB Series (SIP) Forward Voltage 12 10 8 IF (A) 6 4 2 0 0.4 0.5 0.6 0.7 0.8 VF (V) 0.9 1 1.1 TJ=150C TJ=25C P - Io Curve 14 12 10 P (W) 8 6 4 2 0 0 1 2 3 Io (A) 4 5 6 Surge Forward Current 130 120 110 100 90 80 70 60 50 1 10 Cycles 100 IFSM (A) Io (A) 10 8 6 4 2 0 0 25 Current Derating Without HS: Tc at PCB Pad (5 mm) With HS: Tc Next to HS Mounting W/O HS W/ HS 50 75 100 Tc (C) 125 150 175 In order to avoid damaging devices, please observe the following precautions: 1. When using automated soldering equipment, use 60/40 (Sn/Pb) solder (melting point of 180C) with a neutral flux similar to rosin. Preheat time should be limited to 1 - 2 minutes at 150C. 2. When using a soldering iron, use a tip temperature of less than 300C (or a soldering iron power of less than 60W). Keep the soldering time below 5 seconds. 3. After soldering, remove any flux residue to avoid corrosion. 4. Because over-voltage or over-current testing may cause permanent damage to the devices, be sure to check the test equipment for proper voltage, current and ground connection prior to beginning the test. 5. If the devices are to be encapsulated, they should be cleaned and dried at 120 5C for at least 24 hours prior to encapsulation. Test for compatibility between the device package and the encapsulation material. |
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